LED Plant Lamp Packaging Technology: Principles and Functions

            LED plant lamp packaging technology is mostly developed and evolved from discrete device packaging technology, but it also has its unique characteristics. 

Generally, the die of a discrete device is sealed within the package, whose main functions are to protect the die and achieve electrical interconnection. However, 

LED plant lamp packaging is designed to output electrical signals, ensure the normal operation of the die, and emit visible light. It involves both electrical and 

optical parameters and technical requirements, making it impossible to simply apply discrete device packaging to LED plant lamps.

             The core lighting component of an LED plant lamp is the pn junction die, which consists of p-type and n-type semiconductors. When minority carriers injected 

into the pn junction recombine with majority carriers, visible light, ultraviolet light, or near-infrared light is emitted. However, the photons emitted from the pn

 junction region are unidirectional, meaning they have an equal chance of being emitted in all directions. Therefore, not all the light generated by the die can be 

released. This primarily depends on the quality of the semiconductor material, the structure and geometric shape of the die, the internal structure of the package,

and the encapsulation materials. To meet application requirements, it is necessary to improve the internal and external quantum efficiency of LEDs.